STCO: driving the More than Moore era

被引:0
|
作者
Biswas, Dwaipayan [1 ]
Myers, James [1 ]
Ryckaert, Julien [1 ]
Samavedam, Srikanth B. [1 ]
机构
[1] IMEC, Leuven, Belgium
来源
2024 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, ISVLSI | 2024年
关键词
CMOS; DTCO; STCO; CMOS2.0;
D O I
10.1109/ISVLSI61997.2024.00013
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Denser CMOS technologies has been a catalyst for continuous miniaturization, driving large volumes at low-cost, enabling unprecedented system level innovations. With new AI/ML applications, there is a shift in momentum towards translating iso-frequency transistor count into architectural performance, such as accelerators, specialized ISA extensions, or lower precision number formats. However, future CMOS nodes will struggle to support this paradigm due to slower density scaling, increasing dollar/environmental costs and power density. This implies that system context becomes increasingly important to the technology definition, while demanding that application-driven system architectures be co-designed with technology. System Technology Co-optimization (STCO) is a promising paradigm, to plot a course for our industry along More than Moore system/technology roadmaps.
引用
收藏
页码:7 / 8
页数:2
相关论文
共 50 条
  • [41] Three-dimensional integration: A more than moore technology
    Lecture Notes in Electrical Engineering, 2015, 350 : 13 - 41
  • [42] More than Moore’s Mores: Computers, Genomics, and the Embrace of Innovation
    Joseph November
    Journal of the History of Biology, 2018, 51 : 807 - 840
  • [43] Digital Microfluidic Biochips: A Vision for Functional Diversity and More than Moore
    Chakrabarty, Krishnendu
    IEEE ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2010), 2010, : 3 - 4
  • [44] More than Moore: GaN HEMTs and Si CMOS Get It Together
    Kazior, T. E.
    LaRoche, J. R.
    Hoke, W. E.
    2013 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS): INTEGRATED CIRCUITS IN GAAS, INP, SIGE, GAN AND OTHER COMPOUND SEMICONDUCTORS, 2013,
  • [45] Measurement Science for "More-Than-Moore" Technology Reliability Assessments
    Okoro, Chukuwdi A.
    Ahn, Jung-Joon
    Kelso, Meagan
    Kabos, Pavel
    Kopanski, Joseph J.
    Obeng, Yaw S.
    INTERNATIONAL SYMPOSIUM ON FUNCTIONAL DIVERSIFICATION OF SEMICONDUCTOR ELECTRONICS, 2012, 50 (14): : 71 - 79
  • [46] FPGA based silicon innovation exploiting "More than Moore" technology
    Quinn, Patrick J.
    2013 9TH CONFERENCE ON PH. D. RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2013), 2013, : 11 - 12
  • [47] Digital Microfluidic Biochips: A Vision for Functional Diversity and More than Moore
    Ho, Tsung-Yi
    Zeng, Jun
    Chakrabarty, Krishnendu
    2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2010, : 578 - 585
  • [48] Digital Microfluidic Biochips: A Vision for Functional Diversity and More than Moore
    Chakrabarty, Krishnendu
    23RD INTERNATIONAL CONFERENCE ON VLSI DESIGN, 2010, : 452 - 457
  • [49] Much More than Moore - a journey from VLSI to disease biomarkers
    Shivashankar, S. A.
    CURRENT SCIENCE, 2019, 116 (01): : 16 - 18