STCO: driving the More than Moore era

被引:0
|
作者
Biswas, Dwaipayan [1 ]
Myers, James [1 ]
Ryckaert, Julien [1 ]
Samavedam, Srikanth B. [1 ]
机构
[1] IMEC, Leuven, Belgium
来源
2024 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, ISVLSI | 2024年
关键词
CMOS; DTCO; STCO; CMOS2.0;
D O I
10.1109/ISVLSI61997.2024.00013
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Denser CMOS technologies has been a catalyst for continuous miniaturization, driving large volumes at low-cost, enabling unprecedented system level innovations. With new AI/ML applications, there is a shift in momentum towards translating iso-frequency transistor count into architectural performance, such as accelerators, specialized ISA extensions, or lower precision number formats. However, future CMOS nodes will struggle to support this paradigm due to slower density scaling, increasing dollar/environmental costs and power density. This implies that system context becomes increasingly important to the technology definition, while demanding that application-driven system architectures be co-designed with technology. System Technology Co-optimization (STCO) is a promising paradigm, to plot a course for our industry along More than Moore system/technology roadmaps.
引用
收藏
页码:7 / 8
页数:2
相关论文
共 50 条
  • [31] ITRS 2010: A More-than-Moore Roadmap?
    Derbyshire, Katherine
    SOLID STATE TECHNOLOGY, 2011, 54 (03) : 7 - 7
  • [32] High-Performance Photonic BiCMOS - Next Generation More-than-Moore Technology for the Large Bandwidth Era
    Zimmermann, L.
    SIGE, GE, AND RELATED COMPOUNDS 6: MATERIALS, PROCESSING, AND DEVICES, 2014, 64 (06): : 13 - 18
  • [33] It Takes More than Moore to Answer Existence-Questions
    Karl Egerton
    Erkenntnis, 2021, 86 : 355 - 366
  • [34] More Than Moore's Law - Scaling with Silicon Photonics
    Chen, Young-Kai
    2016 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2016,
  • [35] It Takes More than Moore to Answer Existence-Questions
    Egerton, Karl
    ERKENNTNIS, 2021, 86 (02) : 355 - 366
  • [36] Centip3De Demonstrates More than Moore ...
    Borkar, Shekhar
    COMMUNICATIONS OF THE ACM, 2013, 56 (11) : 96 - 96
  • [37] Key Enabling Processes for More-than-Moore Technologies
    Lindner, P.
    Glinsner, T.
    Uhrmann, T.
    Dragoi, V.
    Plach, T.
    Matthias, T.
    Pabo, E.
    Wimplinger, M.
    IEEE INTERNATIONAL SOI CONFERENCE, 2012,
  • [38] III-V: Replacing Si or More than Moore?
    Sun, Yanning
    2010 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2010, : 149 - 150
  • [39] More Than Moore's Law - Scaling with Silicon Photonics
    Chen, Young-Kai
    2016 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2016,
  • [40] Frontiers of More than Moore in Bioelectronics and the Required Metrology Needs
    Guiseppi-Elie, Anthony
    Kotanen, Christian
    Wilson, A. Nolan
    FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011, 2011, 1395