Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination

被引：0
|
作者：
Lu, Fuye [1 ]
Sun, Han [1 ]
Yang, Wenlong [1 ]
Zhou, Tianshuo [1 ]
Wang, Yunpeng [1 ]
Ma, Haoran [2 ]
Ma, Haitao [1 ]
Chen, Jun [2 ]
机构：
[1] School of Materials Science and Engineering, Dalian University of Technology, Dalian,116000, China
[2] School of Microelectronics, Dalian University of Technology, Dalian,116024, China
来源：
Materials | / 17卷 / 21期
基金：
中国国家自然科学基金;
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
5172
中图分类号：
学科分类号：
摘要：
Atmospheric corrosion - Bismuth alloys - Corrosion resistant alloys - Dendrites (metallography) - Electrochemical corrosion - Electronics packaging - Flip chip devices - IV-VI semiconductors - Lead alloys - Lead-free solders - Mercury amalgams - Pollution induced corrosion - Surface discharges - Tin alloys
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