SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS AND LAY).

被引:0
|
作者
Anon
机构
来源
| 1600年
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
SURFACES
引用
收藏
相关论文
共 50 条
  • [32] Prediction of surface roughness on rolled sheet by texture roll
    Fujii, Yasuyuki
    Maeda, Yasushi
    Ifuku, Ryota
    11TH INTERNATIONAL CONFERENCE ON TECHNOLOGY OF PLASTICITY, ICTP 2014, 2014, 81 : 161 - 166
  • [33] Influence of roughness and texture of surface on the holding of the adhesive bond
    De Souza, M.
    Valiorgue, F.
    Bertrand, Ph.
    Henry, N.
    Jeandrau, J. P.
    JA 2013 - JOURNEES ANNUELLES DE LA SF2M 2013 / SF2M ANNUAL MEETING 2013, 2013, 7
  • [34] Hydrodynamic pressure generation caused by surface roughness or texture
    Tonder, Kristian
    PROCEEDINGS OF THE ASME/STLE INTERNATIONAL JOINT TRIBOLOGY CONFERENCE, PTS A AND B, 2008, : 1073 - 1075
  • [35] THE INFLUENCE OF SURFACE TEXTURE ON THE EFFECTIVE ROUGHNESS LENGTH - REPLY
    SCHMID, HP
    BUNZLI, D
    QUARTERLY JOURNAL OF THE ROYAL METEOROLOGICAL SOCIETY, 1995, 121 (525) : 1173 - 1176
  • [36] The influence of workpiece surface texture on visual measurement of roughness
    Yi, Huaian
    Lu, Lingli
    Shu, Aihua
    Qin, Jianhua
    Lu, Enhui
    TM-TECHNISCHES MESSEN, 2022, 89 (11) : 741 - 756
  • [37] Evolution of Surface Roughness and Texture in Cu/Co Multilayers
    Li, Wei
    Wang, Xuanli
    CHINA SURFACE ENGINEERING, 2023, 36 (02) : 138 - 145
  • [38] SURFACE-STRUCTURE, ROUGHNESS, ENERGY AND TEXTURE OF CRYSTALS
    MATYSINA, ZA
    CHUPRINA, LM
    ZAGINAICHENKO, SY
    JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1992, 53 (01) : 167 - 174
  • [39] Effect of WEDM Process Parameters on Surface Roughness and Waviness of Inconel 603XL
    Manikandan, K.
    Kumar, P. Ranjith
    Muthukumaran, S.
    Kumar, B. Suresh
    JOURNAL OF NEW MATERIALS FOR ELECTROCHEMICAL SYSTEMS, 2020, 23 (01) : 31 - 35
  • [40] Concept and basic study of improvement system of surface roughness, waviness and figure accuracy by WORFAC
    NIKON Corp, Tokyo, Japan
    J Mater Process Technol, 4 (423-426):