LOW-COST MANUFACTURING TECHNIQUES FOR THICK-FILM MICROWAVE CIRCUITS.

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作者：

Schelhorn, Robert L.

机构：

来源：

Electronic Packaging and Production | 1981年 / 21卷 / 01期

关键词：

Compendex;

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摘要：

MICROWAVE DEVICES

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页码：83 / 95

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