LOW-COST MANUFACTURING TECHNIQUES FOR THICK-FILM MICROWAVE CIRCUITS.

被引：0
|
作者：
Schelhorn, Robert L.
机构：
来源：
Electronic Packaging and Production | 1981年 / 21卷 / 01期
关键词：
Compendex;
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摘要：
MICROWAVE DEVICES
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页码：83 / 95
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