AUTOMATIC SYSTEM FOR CHEMICAL VAPOR DEPOSITION IN INTEGRATED CIRCUIT PROCESSING.

A complete, computer-controlled, automatic chemical vapor deposition system has been developed by NASA for applications in the processing of three-inch silicon wafers, three-inch sapphire substrates, or three-inch spinel substrates. All chemical vapor deposition process parameters are controlled by a programmer that can be entirely preset, and any parameter can be varied ″in-process″ and with manual override capability for any and all functions. The system is designed with personnel safety in mind. The hardware of the system is briefly described.