Influence of interdiffusion of metals in an evaporated multilayer metallization on the adhesion of an Sn-Sb solder

被引：0
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作者：
Kurihara, Yasutoshi [1 ]
Hosokawa, Takashi [1 ]
Saitoh, Ryuichi [1 ]
机构：
[1] Hitachi, Ltd, Hitachi, Japan
来源：
Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi) | 1995年 / 78卷 / 07期
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摘要：
7
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页码：82 / 90
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