Influence of oxidation of a multilayer metallization on the adhesion of an Sn-Sb solder

被引：0
|
作者：
Kurihara, Yasutoshi [1 ]
Hosokawa, Takashi [1 ]
Saitoh, Ryuichi [1 ]
机构：
[1] Hitachi, Ltd, Hitachi, Japan
来源：
Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi) | 1995年 / 78卷 / 02期
关键词：
Complex metallurgical interaction - Die bonding - Molten solder - Multilayer metallization - Nickel oxide - Silicon chip surfaces;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：42 / 51
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