Influence of interdiffusion of metals in an evaporated multilayer metallization on the adhesion of an Sn-Sb solder

被引：0
|
作者：
Kurihara, Yasutoshi [1 ]
Hosokawa, Takashi [1 ]
Saitoh, Ryuichi [1 ]
机构：
[1] Hitachi, Ltd, Hitachi, Japan
来源：
Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi) | 1995年 / 78卷 / 07期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
7
引用
收藏
页码：82 / 90
相关论文
共 50 条
  • [31] Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn-Ag-Cu solder alloys
    Li, Feng
    Verdingovas, Vadimas
    Dirscherl, Kai
    Harsanyi, Gabor
    Medgyes, Balint
    Ambat, Rajan
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (18) : 15308 - 15321
  • [32] Influence of Sb on IMC growth in Sn-Ag-Cu-SbPb-free solder joints in reflow process
    Chen, BL
    Li, GY
    THIN SOLID FILMS, 2004, 462 : 395 - 401
  • [33] Influence of copper addition on adhesive strength of Sn-3Ag-1•5Sb solder joints
    Lee, HT
    Chen, MH
    Jao, HM
    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2004, 9 (06) : 555 - 559
  • [34] INFLUENCE OF SMALL ADDITIONS OF BI AND SN IN SOLDER ON THE WETTABILITY, WORK OF ADHESION, AND CONTACT RESISTANCE AT THE INTERFACE BETWEEN SINGLE-CRYSTALS OF SOLID-SOLUTIONS OF THE BI-SB SYSTEM
    DZHAMALOV, NA
    BARKHALOV, BS
    FEIZIEV, YS
    SALAEV, EY
    GASANOVA, NA
    ABDINOV, DS
    INORGANIC MATERIALS, 1985, 21 (11) : 1649 - 1651
  • [35] Influence of phosphorus content on the interfacial microstructure between Sn-3.SAg solder and electroless Ni-P metallization on Cu substrate
    Mona
    Kumar, Aditya
    Chen, Zhong
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (01): : 68 - 72
  • [36] Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
    Shao, TL
    Lin, KC
    Chen, C
    JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) : 1278 - 1283
  • [37] Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
    T. L. Shao
    K. C. Lin
    Chih Chen
    Journal of Electronic Materials, 2003, 32 : 1278 - 1283
  • [38] Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization
    Chen, Hongtao
    Wang, Chunqing
    Li, Mingyu
    Tian, Dewen
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2007, 23 (01) : 68 - 72
  • [39] Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization
    Hongtao CHEN
    JournalofMaterialsScience&Technology, 2007, (01) : 70 - 74
  • [40] Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization
    Chen, Hongtao
    Wang, Chunqing
    Li, Mingyu
    Tian, Dewen
    Journal of Materials Science and Technology, 2007, 23 (01): : 68 - 72
12345