ELECTROLESS COPPER PLATING USING DIMETHYLAMINE BORANE.

被引：0
|
作者：
Pearlstein, F.
Weightman, R.F.
机构：
来源：
Plating | 1973年 / 60卷 / 05期
关键词：
ELECTROLESS PLATING - PROTECTIVE COATINGS - TIN AND ALLOYS;
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学科分类号：
摘要：
Electroless copper plating from baths containing dimethylamine borane is discussed. An ammoniacal alkaline bath was developed that produces electroless copper deposits at 2. 3 mu m/hr on a variety of substrates; the deposits contain less than 0. 1 per cent boron. The addition of stannous chloride to the electroless copper plating bath resulted in deposition of copper-tin alloy; a bath is described that provides deposits containing ten per cent tin.
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页码：474 / 476
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