ELECTROLESS COPPER PLATING USING DIMETHYLAMINE BORANE.

Electroless copper plating from baths containing dimethylamine borane is discussed. An ammoniacal alkaline bath was developed that produces electroless copper deposits at 2. 3 mu m/hr on a variety of substrates; the deposits contain less than 0. 1 per cent boron. The addition of stannous chloride to the electroless copper plating bath resulted in deposition of copper-tin alloy; a bath is described that provides deposits containing ten per cent tin.