Self-aligned, fluxless flip-chip bonding technology for photonic devices

被引：0
|
作者：
Kuhmann, J.F. [1 ]
Hensel, H.-J. [1 ]
Pech, D. [1 ]
Harde, P. [1 ]
Bach, H.-G. [1 ]
机构：
[1] Heinrich-Hertz-Inst fuer, Nachrichtentechnik Berlin GmbH, Berlin, Germany
来源：
Proceedings - Electronic Components and Technology Conference | 1996年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Flip chip devices
引用
收藏
页码：1088 / 1092
相关论文
共 50 条
  • [41] Gold to gold thermosonic flip-chip bonding
    Cheah, LK
    Tan, YM
    Wei, J
    Wong, CK
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 165 - 170
  • [42] Developments of optimum flip-chip bonding process
    Jang, DH
    Kang, SY
    Lee, YM
    Oh, SY
    MICROELECTRONIC PACKAGING AND LASER PROCESSING, 1997, 3184 : 5 - 12
  • [43] Thermosonic flip-chip bonding for SAW filter
    Tomioka, T
    Iguchi, T
    Mori, I
    MICROELECTRONICS RELIABILITY, 2004, 44 (01) : 149 - 154
  • [44] STUDIES OF THERMOSONIC BONDING FOR FLIP-CHIP ASSEMBLY
    KANG, SY
    WILLIAMS, PM
    MCLAREN, TS
    LEE, YC
    MATERIALS CHEMISTRY AND PHYSICS, 1995, 42 (01) : 31 - 37
  • [45] Investigation of flip-chip bonding for MEMS applications
    Salalha, W
    Zussman, E
    Bar-Yoseph, PZ
    JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (01) : 48 - 51
  • [46] Fluxless Flip Chip Interconnects for MEMS Devices for Heterogeneous Integration
    Lee, Teck Kheng
    2018 IEEE 8TH INTERNATIONAL NANOELECTRONICS CONFERENCES (INEC), 2018, : 21 - 22
  • [47] Flip-chip technology at the frontier of science
    不详
    GEC JOURNAL OF TECHNOLOGY, 1998, 15 (01): : 61 - 62
  • [48] Study on reflow process of SWIR FPA during flip-chip bonding technology
    Fan Cui
    Li Xue
    Shao Xiumei
    Zeng Zhijiang
    Tang Hengjing
    Li Tao
    Gong Haimei
    INFRARED TECHNOLOGY AND APPLICATIONS XLII, 2016, 9819
  • [49] Evaluation of ultrasonic vibration energy for copper-to-copper bonding by flip-chip bonding technology
    Arai, Yoshiyuki
    Miyamoto, Yoshinori
    Nimura, Masatsugu
    Tomokage, Hajime
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 658 - 661
  • [50] Flip-chip bonding technology fabricates GHz-band SAW filters
    Eda, Kazuo
    Ohnishi, Keiji
    JEE. Journal of electronic engineering, 1993, 30 (324): : 36 - 39
12345