Self-aligned, fluxless flip-chip bonding technology for photonic devices

被引：0
|
作者：
Kuhmann, J.F. [1 ]
Hensel, H.-J. [1 ]
Pech, D. [1 ]
Harde, P. [1 ]
Bach, H.-G. [1 ]
机构：
[1] Heinrich-Hertz-Inst fuer, Nachrichtentechnik Berlin GmbH, Berlin, Germany
来源：
Proceedings - Electronic Components and Technology Conference | 1996年
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D O I：
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学科分类号：
摘要：
Flip chip devices
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页码：1088 / 1092
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