Electromigration transport mechanisms in Al thin-film conductors

被引：0
|
作者：
机构：
来源：
J Appl Phys | / 1卷 / 163期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] The influence of thin-film heater shape parameters on the electromigration
    Huang Fei
    Ding Shanting
    Li Huajing
    SEVENTH INTERNATIONAL SYMPOSIUM ON PRECISION MECHANICAL MEASUREMENTS, 2016, 9903
  • [42] ELECTROMIGRATION IN THIN-FILM PHOTOVOLTAIC MODULE METALLIZATION SYSTEMS
    WEN, L
    MON, G
    JETTER, E
    ROSS, R
    CONFERENCE RECORD OF THE TWENTIETH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE - 1988, VOLS 1-2, 1988, : 364 - 369
  • [43] Electromigration Measurements in Thin-Film IPD and eWLB Interconnections
    Frye, Robert
    Liu, Kai
    Aung, KyawOo
    Chelvam, M. Pandi
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1304 - 1311
  • [44] The analysis of thermal stress effect on electromigration failure time in Al alloy thin-film interconnects
    Lee, SH
    Kwon, D
    THIN SOLID FILMS, 1999, 341 (1-2) : 136 - 139
  • [45] Analysis of thermal stress effect on electromigration failure time in Al alloy thin-film interconnects
    Lee, S.H.
    Kwon, D.
    Thin Solid Films, 1999, 341 (01): : 136 - 139
  • [46] Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects
    Kim, CU
    Morris, JW
    Lee, HM
    JOURNAL OF APPLIED PHYSICS, 1997, 82 (04) : 1592 - 1598
  • [47] REACTIVELY BONDED THIN-FILM CONDUCTORS, A NEW COMPONENT FOR COMBINATION THIN-FILM AND THICK-FILM TECHNOLOGY
    REISS, S
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03): : 190 - 194
  • [48] Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects
    J Appl Phys, 4 (1592):
  • [49] AGING MECHANISMS IN THIN-FILM AL-AL2O3-AL CAPACITORS
    BERLICKI, TM
    OSADNIK, SJ
    THIN SOLID FILMS, 1976, 36 (02) : 349 - 351
  • [50] ITO THIN-FILM TRANSPARENT CONDUCTORS - MICROSTRUCTURE AND PROCESSING
    SHIGESATO, Y
    YASUI, I
    PAINE, DC
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1995, 47 (03): : 47 - 50
12345