共 50 条
- [1] Electromigration transport mechanisms in Al thin-film conductorsJOURNAL OF APPLIED PHYSICS, 1996, 79 (01) : 163 - 169Oates, AS
- [2] ELECTROMIGRATION OF NI IN AL THIN-FILM CONDUCTORSJOURNAL OF APPLIED PHYSICS, 1975, 46 (11) : 4845 - 4846DHEURLE, FMGANGULEE, AALIOTTA, CFRANIERI, VA
- [3] Electromigration mass transport phenomena in Al thin-film conductors with bamboo microstructureSTRESS INDUCED PHENOMENA IN METALLIZATION - FOURTH INTERNATIONAL WORKSHOP, 1998, (418): : 39 - 51Oates, AS
- [4] ELECTROMIGRATION THRESHOLD OF THIN-FILM CONDUCTORSTHIN SOLID FILMS, 1990, 192 (01) : 181 - 191KOLESHKO, VMKIRYUSHIN, IV
- [5] EFFECTS OF MG ADDITIONS ON ELECTROMIGRATION BEHAVIOR OF AL THIN-FILM CONDUCTORSJOURNAL OF ELECTRONIC MATERIALS, 1975, 4 (03) : 497 - 515DHEURLE, FMGANGULEE, AALIOTTA, CFRANIERI, VA
- [6] ELECTROMIGRATION FAILURE IN AU THIN-FILM CONDUCTORSIEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, : 107 - 112AGARWALA, BN
- [7] ELECTROMIGRATION IN GOLD AND COPPER THIN-FILM CONDUCTORSTHIN SOLID FILMS, 1980, 69 (03) : 379 - 386MILLER, RJGANGULEE, A
- [8] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORSJOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 283 - &AGARWALA, BNSCHNITZE.RPATNAIK, B
- [9] THE EFFECT OF MICROSTRUCTURE ON THE RESISTANCE TO ELECTROMIGRATION OF AL-CU THIN-FILM CONDUCTORSTHIN SOLID FILMS, 1991, 196 (01) : 47 - 63PATRINOS, AJSCHWARZ, JA
- [10] ELECTROMIGRATION-INDUCED FAILURES IN THIN-FILM AL-CU CONDUCTORSJOURNAL OF ELECTRONIC MATERIALS, 1974, 3 (01) : 137 - 153AGARWALA, BNBERENBAUM, LPERESSININ, P
