Step-by-step: SMT Step 4 - Printing

被引：0
|
作者：
Prasad, Ray P. [1 ]
机构：
[1] P.O. Box 219179, Portland, OR 97225, United States
来源：
SMT Surface Mount Technology Magazine | 2001年 / 15卷 / 04期
关键词：
Fine pitch - Paste applications - Paste in hole process - Reflow soldering - Screen printer - Solder paste - Squeegee - Stencil;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
页码：88 / 91
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