Step-by-step: SMT Step 4 - Printing

被引：0

作者：

Prasad, Ray P. ^{[1
]}

机构：

[1] P.O. Box 219179, Portland, OR 97225, United States

来源：

SMT Surface Mount Technology Magazine | 2001年 / 15卷 / 04期

关键词：

Fine pitch - Paste applications - Paste in hole process - Reflow soldering - Screen printer - Solder paste - Squeegee - Stencil;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

(Edited Abstract)

引用

页码：88 / 91

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