Thermal issues count in high-power amp design

被引：0
|
作者：
Robinson, Sam [1 ]
机构：
[1] Apex Microtechnology Corp., Tucson, AZ
来源：
Power Electronics Technology | 2005年 / 31卷 / 06期
关键词：
D O I：
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学科分类号：
摘要：
Heat sinks
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页码：44 / 50
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