Thermal issues count in high-power amp design

被引：0
|
作者：
Robinson, Sam [1 ]
机构：
[1] Apex Microtechnology Corp., Tucson, AZ
来源：
Power Electronics Technology | 2005年 / 31卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Heat sinks
引用
收藏
页码：44 / 50
相关论文
共 50 条
  • [1] THERMAL DESIGN OF A HIGH-POWER AMPLIFIER
    VERANTH, JL
    AUDIO, 1974, 58 (02): : 24 - &
  • [2] Thermal design for the high-power LED lamp
    田晓改
    陈伟
    张继勇
    半导体学报, 2011, 32 (01) : 61 - 64
  • [3] Concurrent thermal design for high-power electronics
    Lall, BS
    FOURTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1998, : 95 - 103
  • [4] Thermal design for the high-power LED lamp
    Tian Xiaogai
    Chen Wei
    Zhang Jiyong
    JOURNAL OF SEMICONDUCTORS, 2011, 32 (01)
  • [5] Thermal Issues in Micromachined Spiral Inductors for High-Power Applications
    Sagkol, Huseyin
    Rejaei, Behzad
    Burghartz, Joachim N.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (11) : 3288 - 3294
  • [6] Thermal and mechanical issues of high-power laser diode degradation
    Jorge Souto
    José Luis Pura
    Juan Jiménez
    MRS Communications, 2018, 8 : 995 - 999
  • [7] Thermal and mechanical issues of high-power laser diode degradation
    Souto, Jorge
    Luis Pura, Jose
    Jimenez, Juan
    MRS COMMUNICATIONS, 2018, 8 (03) : 995 - 999
  • [8] High-power amp includes disable
    Smith, S
    EDN, 1997, 42 (05) : 112 - &
  • [9] Thermal design of high-power LED package and system
    Shin, Moo Whan
    ADVANCED LEDS FOR SOLID STATE LIGHTING, 2006, 6355
  • [10] Thermal Design of RF Window for High-Power Gyrotron
    Alaria, Mukesh Kumar
    Bhomia, Vikas
    Nayek, N.
    Das, Subrata
    Sinha, A. K.
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2011, 39 (09) : 1795 - 1799
12345