Technical review on thermal conductivity measurement techniques for thin thermal interfaces

被引：0

作者：

Tzeng, Jim J.-W. ^{[1
]}

Weber, Tom W. ^{[1
]}

Krassowski, Dan W. ^{[1
]}

机构：

[1] UCAR Graph-Tech Inc, Parma, United States

来源：

Annual IEEE Semiconductor Thermal Measurement and Management Symposium | 2000年

关键词：

Equations of motion - Heat conduction - Interfaces (materials) - Measurement errors - Standards - Thermal conductivity of solids;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A fundamental and philosophical view of an ideal thermal conductivity measurement system is presented. A measurement device and a technique were developed that incorporates these ideals by modifying existing ASTM test methods. The developed technique provides a systematic means of minimizing measurement errors and increasing measurement sensitivity.

引用

页码：174 / 181

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