Technical review on thermal conductivity measurement techniques for thin thermal interfaces

被引：0
|
作者：
Tzeng, Jim J.-W. [1 ]
Weber, Tom W. [1 ]
Krassowski, Dan W. [1 ]
机构：
[1] UCAR Graph-Tech Inc, Parma, United States
来源：
Annual IEEE Semiconductor Thermal Measurement and Management Symposium | 2000年
关键词：
Equations of motion - Heat conduction - Interfaces (materials) - Measurement errors - Standards - Thermal conductivity of solids;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A fundamental and philosophical view of an ideal thermal conductivity measurement system is presented. A measurement device and a technique were developed that incorporates these ideals by modifying existing ASTM test methods. The developed technique provides a systematic means of minimizing measurement errors and increasing measurement sensitivity.
引用
收藏
页码：174 / 181
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