THICK FILM AND DIRECT BOND COPPER FORMING TECHNOLOGIES FOR ALUMINUM NITRIDE SUBSTRATE.

被引：0
|
作者：
Iwase, Nobuo [1 ]
Anzai, Kazuo [1 ]
Shinozaki, Kazuo [1 ]
Hirao, Osamu [1 ]
Thanh, Troung Dinh [1 ]
Sugiura, Yasuyuki [1 ]
机构：
[1] Toshiba Yanagicho Works, Kawasaki, Jpn, Toshiba Yanagicho Works, Kawasaki, Jpn
来源：
IEEE transactions on components, hybrids, and manufacturing technology | 1984年 / CHMT-8卷 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
5
引用
收藏
页码：253 / 258
相关论文
共 50 条
  • [41] EFFECTS OF LASER TRIMMING THICK-FILM RESISTOR MATERIALS ON ALUMINUM NITRIDE SUBSTRATES
    ACKERMAN, G
    HANKEY, DL
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 231 - 239
  • [42] Shear-horizontal piezoelectric waves in an aluminum nitride film on a silicon substrate
    Chen, Hui
    Wang, Ji
    Du, Jianke
    Yang, Jiashi
    MECHANICS OF ADVANCED MATERIALS AND STRUCTURES, 2016, 23 (07) : 764 - 773
  • [43] DBC (Direct Bond Copper) substrate with integrated flat heat pipe
    Schulz-Harder, Juergen
    Dezord, Jean Bernard
    Schaeffer, Christian
    Avenas, Yvan
    Puig, Olivier
    Rogg, Alexander
    Exel, Karl
    Utz-Kistner, Andreas
    TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, : 152 - +
  • [44] Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate
    Lei, Thomas Guangyin
    Calata, Jesus Noel
    Ngo, Khai D. T.
    Lu, Guo-Quan
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2009, 9 (04) : 563 - 568
  • [45] The electrical properties of oxides-added thick-film resistors on aluminum nitride substrates
    Hsieh, ML
    Chen, LS
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 468 - 471
  • [46] BINDER CHEMISTRY, ADHESION AND STRUCTURE OF INTERFACES IN THICK-FILM METALLIZED ALUMINUM NITRIDE SUBSTRATES
    NEWBERG, CE
    RISBUD, SH
    JOURNAL OF MATERIALS SCIENCE, 1992, 27 (10) : 2670 - 2676
  • [47] Effect of surface modification Al or Ti film on bond strength of joining aluminum nitride to metals
    Wlosinski, W
    Zhu, S
    SURFACE ENGINEERING: SCIENCE AND TECHNOLOGY I, 1999, : 195 - 204
  • [48] Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates
    Molisani, Andre Luiz
    Yoshimura, Humberto Naoyuki
    ADVANCED POWDER TECHNOLOGY VII, 2010, 660-661 : 658 - 663
  • [49] The impact of film thickness and substrate surface roughness on the thermal resistance of aluminum nitride nucleation layers
    Su, Zonghui
    Freedman, Justin P.
    Leach, Jacob H.
    Preble, Edward A.
    Davis, Robert F.
    Malen, Jonathan A.
    JOURNAL OF APPLIED PHYSICS, 2013, 113 (21)
  • [50] LASER DIRECT WRITING OF COPPER ON VARIOUS THIN-FILM SUBSTRATE MATERIALS
    MULLER, HG
    BUSCHICK, K
    SCHULER, S
    PAREDES, A
    APPLIED SURFACE SCIENCE, 1990, 46 (1-4) : 143 - 147
12345