THICK FILM AND DIRECT BOND COPPER FORMING TECHNOLOGIES FOR ALUMINUM NITRIDE SUBSTRATE.

被引:0
|
作者
Iwase, Nobuo [1 ]
Anzai, Kazuo [1 ]
Shinozaki, Kazuo [1 ]
Hirao, Osamu [1 ]
Thanh, Troung Dinh [1 ]
Sugiura, Yasuyuki [1 ]
机构
[1] Toshiba Yanagicho Works, Kawasaki, Jpn, Toshiba Yanagicho Works, Kawasaki, Jpn
来源
IEEE transactions on components, hybrids, and manufacturing technology | 1984年 / CHMT-8卷 / 02期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
5
引用
收藏
页码:253 / 258
相关论文
共 50 条
  • [31] Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer
    Yanagimoto, H
    Deki, S
    Akamatsu, K
    Gotoh, K
    THIN SOLID FILMS, 2005, 491 (1-2) : 18 - 22
  • [32] GLASS-CERAMIC INTERACTIONS AND THICK-FILM METALLIZATION OF ALUMINUM NITRIDE
    NORTON, MG
    JOURNAL OF MATERIALS SCIENCE, 1991, 26 (09) : 2322 - 2328
  • [33] Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer
    Zhang, Pengfei
    Fu, Renli
    Tang, Ye
    Cao, Bing
    Fei, Meng
    Yang, Yang
    CERAMICS INTERNATIONAL, 2015, 41 (10) : 13381 - 13388
  • [34] Bonding of copper to aluminum nitride substrate using active alloy interlayer
    Bai, SQ
    Chen, LD
    Yamamura, A
    FUNCTIONALLY GRADED MATERIALS VII, 2003, 423-4 : 301 - 303
  • [35] Cracking of aluminum nitride film on stainless steel substrate at elevated temperature
    Nishijima, Dai
    Tabaru, Tatsuo
    Akiyama, Morito
    PRICM 6: SIXTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-3, 2007, 561-565 : 1221 - 1224
  • [36] COLD GAS SPRAY OF COPPER ON ALUMINUM NITRIDE AS SUBSTRATE FOR POWER ELECTRONICS
    Guerrero, Margie
    Quintero, Pedro
    Ozdemir, Ozan
    Schwartz, Tricia
    PROCEEDINGS OF ASME 2021 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2021), 2021,
  • [37] Poly-Crystalline Thin-Film by Aluminum Induced Crystallization on Aluminum Nitride Substrate
    Bhopal, Muhammad Fahad
    Lee, Doo Won
    Lee, Soo Hong
    ELECTRONIC MATERIALS LETTERS, 2016, 12 (05) : 651 - 659
  • [38] Poly-crystalline thin-film by aluminum induced crystallization on aluminum nitride substrate
    Muhammad Fahad Bhopal
    Doo Won Lee
    Soo Hong Lee
    Electronic Materials Letters, 2016, 12 : 651 - 659
  • [39] Theoretical model for ablation of thick aluminum film on polyimide substrate by laser etching
    Liu, Xiaoli
    Xiong, Yuqing
    Ren, Ni
    Wang, Rui
    Wu, Gan
    JOURNAL OF LASER APPLICATIONS, 2018, 30 (04)
  • [40] Study of silver-palladium thick film conductor for metallisation of aluminium nitride substrate
    Tian, MB
    Zheng, DF
    Wang, YQ
    He, W
    BRITISH CERAMIC TRANSACTIONS, 2002, 101 (04): : 169 - 171