THICK FILM AND DIRECT BOND COPPER FORMING TECHNOLOGIES FOR ALUMINUM NITRIDE SUBSTRATE.

被引：0
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作者：
Iwase, Nobuo [1 ]
Anzai, Kazuo [1 ]
Shinozaki, Kazuo [1 ]
Hirao, Osamu [1 ]
Thanh, Troung Dinh [1 ]
Sugiura, Yasuyuki [1 ]
机构：
[1] Toshiba Yanagicho Works, Kawasaki, Jpn, Toshiba Yanagicho Works, Kawasaki, Jpn
来源：
IEEE transactions on components, hybrids, and manufacturing technology | 1984年 / CHMT-8卷 / 02期
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页码：253 / 258
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