Copper/low-k interconnects for smaller and faster circuits

被引：0
|
作者：
Mavoori, Hareesh [1 ]
机构：
[1] the Applied Materials and Metallurgy Group at Bell Laboratories, Lucent Technologies, United States
来源：
JOM | 1999年 / 51卷 / 09期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Effect of Joule Heating on Electromigration in Dual-Damascene Copper Low-k Interconnects
    Lee, Ki-Don
    Kim, Jinseok
    Jeong, Tae-Young
    Zhao, Yinghong
    Yuan, Quan
    Patel, Anuj
    Mai, Zack T.
    Brown, Logan H.
    English, Steven
    Sawyer, Daniel
    2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,
  • [22] Experimental characterization of copper/low-k transmission line interconnects through microwave measurements
    Kim, J
    Neikirk, DP
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 93 - 96
  • [23] Die-based electromigration characterization for copper/low-K dual damascene interconnects
    Lee, Shou-Chung
    Oates, Anthony S.
    2006 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2006, : 131 - +
  • [24] Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
    Tökei, Z
    Patz, M
    Schmidt, M
    Iacopi, F
    Demuynck, S
    Maex, K
    MICROELECTRONIC ENGINEERING, 2004, 76 (1-4) : 70 - 75
  • [25] Current and future low-k dielectrics for Cu interconnects
    Kikkawa, T
    INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 253 - 256
  • [26] Advanced Patterning Approaches for Cu/Low-k interconnects
    Tsai, C. H.
    Lee, C. J.
    Huang, C. H.
    Wu, Jay
    Tien, H. W.
    Yao, H. C.
    Wang, Y. C.
    Shue, S. L.
    Cao, M.
    2017 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2017,
  • [27] Mechanical stability of Cu/low-k BEOL Interconnects
    Gonzalez, Mario
    Vanstreels, Kris
    Cherman, Vladimir
    Croes, Kristof
    Kljucar, Luka
    De Wolf, Ingrid
    Tokei, Zsolt
    2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,
  • [28] Co capping layers for Cu/low-k interconnects
    Yang, C. -C.
    Flaitz, P.
    Li, B.
    Chen, F.
    Christiansen, C.
    Lee, S. -Y.
    Ma, P.
    Edelstein, D.
    MICROELECTRONIC ENGINEERING, 2012, 92 : 79 - 82
  • [29] Mechanical failure prediction of copper/low-k dielectric interconnects using cohesive zone modeling
    van Hal, BAE
    Peerlings, RHJ
    Zhang, GQ
    ADVANCED METALLIZATION CONFERENCE 2005 (AMC 2005), 2006, : 679 - 683
  • [30] Packaging effects on reliability of Cu/Low-k interconnects
    Wang, GT
    Merrill, C
    Zhao, JH
    Groothuis, SK
    Ho, PS
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2003, 3 (04) : 119 - 128
12345