Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

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作者：
Kloeser, Joachim [1 ]
Heinricht, Katrin [1 ]
Kutzner, Kai [1 ]
Jung, Erik [1 ]
Ostmann, Andreas [1 ]
Reichl, Herbert [1 ]
机构：
[1] Fraunhofer Inst FhG/IZM-Berlin, Berlin, Germany
来源：
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1998年 / 21卷 / 01期
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页码：41 / 50
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