Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

被引：0
|
作者：
Kloeser, Joachim [1 ]
Heinricht, Katrin [1 ]
Kutzner, Kai [1 ]
Jung, Erik [1 ]
Ostmann, Andreas [1 ]
Reichl, Herbert [1 ]
机构：
[1] Fraunhofer Inst FhG/IZM-Berlin, Berlin, Germany
来源：
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1998年 / 21卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：41 / 50
相关论文
共 50 条
  • [21] High density fine pitch Pb-free flip-chip interconnect assembly
    Lim, SPS
    Lam, CK
    Lee, C
    Teo, PS
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 65 - 71
  • [22] Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 pb-free solder pastes used for flip chip
    Jackson, GJ
    Hendriksen, MW
    Durairaj, RK
    Ekere, NN
    Desmulliez, MPY
    Kay, RW
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 536 - 543
  • [23] Reliability assessment of high density fine pitch lead-free flip chip package
    Chong, SC
    Ting, S
    Meng, TY
    Chong, CT
    Sampath, S
    Yin, HW
    Lim, S
    Kweng, CC
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 433 - 437
  • [24] Evaluation of process parameters for flip chip stencil printing
    Nguty, TA
    Riedlin, MHA
    Ekere, NN
    TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 206 - 216
  • [25] Nanoindentation study of the Pb-free solders in fine pitch interconnects
    Mohankumar, K
    Tay, AAO
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 483 - 489
  • [26] Fine pitch stencil printing using enclosed printing systems
    Zou, LC
    Dusek, M
    Wickham, M
    Hunt, C
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2003, 15 (01) : 43 - 49
  • [27] Stencil printing process development for flip chip interconnect
    Li, L
    Thompson, P
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (03): : 165 - 170
  • [28] Flip chip with lead-free solders on halogen-free microvia substrates
    Baynham, G.
    Baldwin, D.F.
    Boustedt, K.
    Wennerholm, C.
    Proceedings - Electronic Components and Technology Conference, 2001, : 1135 - 1139
  • [29] Flip chip with lead-free solders on halogen-free microvia substrates
    Baynham, G
    Baldwin, DF
    Boustedt, K
    Wennerholm, C
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1135 - 1139
  • [30] Assembly challenges of high density large fine pitch lead-free flip chip package
    Chong, Ser Choong
    Tan, Yeow Meng
    Chai, Tai Chong
    Lim, Samuel
    Hnin, Wai Yin
    Cheng, Chek Kweng
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 10 - +
12345