Nondestructive and contactless characterization of layers

被引:0
|
作者
Sklarczyk, Christoph
Ehlen, Frank
Netzelmann, Udo
机构
来源
Materialpruefung/Materials Testing | 1998年 / 40卷 / 04期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
(Edited Abstract)
引用
收藏
页码:149 / 153
相关论文
共 50 条
  • [21] Nondestructive determination of wear protection layers
    Neumaier, Peter
    Materialpruefung/Materials Testing, 1999, 41 (06):
  • [22] Nondestructive and contactless evaluation of surface coatings and adhesion defects by photothermal radiometry
    Ritter, R
    Reick, M
    Schmitz, B
    Goch, G
    OPTICAL INSPECTION AND MICROMEASUREMENTS, 1996, 2782 : 662 - 673
  • [23] Nondestructive contactless electron-beam diagnostics of microelectronic device structures
    Aleksandrov A.F.
    Ditsman S.A.
    Luk'Yanov F.A.
    Orlikovskii N.A.
    Rau E.I.
    Sennov R.A.
    Russian Microelectronics, 2010, 39 (05) : 303 - 312
  • [24] Nondestructive analysis of liquid oxides in contactless conditions by synchrotron radiation and neutrons
    Landron, C
    Hennet, L
    Thiaudiere, D
    Price, DL
    NONDESTRUCTIVE CHARACTERIZATION OF MATERIALS XI, 2003, : 207 - 213
  • [25] Contactless nondestructive method for determination of the carrier diffusion length in semiconductors and dielectrics
    Manukhov, V. V.
    Fedortsov, A. B.
    18TH RUSSIAN YOUTH CONFERENCE ON PHYSICS OF SEMICONDUCTORS AND NANOSTRUCTURES, OPTO- AND NANOELECTRONICS, 2017, 816
  • [26] A UHV contactless capacitance-voltage characterization method applicable to semiconductor layers grown on insulating substrates
    Akazawa, M
    Hasegawa, H
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 2003, 195 (01): : 248 - 254
  • [27] NONDESTRUCTIVE CHARACTERIZATION OF MATERIALS
    KOPINECK, HJ
    STAHL UND EISEN, 1991, 111 (05): : 107 - 108
  • [28] Nondestructive characterization of greenware
    Dietz, M
    Tietz, HD
    May, B
    Bühling, L
    ANNUAL MEETING 1998 - NONDESTRUCTIVE MATERIALS TESTING: NONDESTRUCTIVE TESTING OF WELD JOINTS 70 YEARS LATER, 1997, 63 (1-2): : 629 - 639
  • [29] NONDESTRUCTIVE CHARACTERIZATION OF MATERIALS
    GREEN, RE
    ADVANCED MATERIALS & PROCESSES, 1989, 136 (05): : 20 - 22
  • [30] Contactless measurement of the thermal conductivity of thin SiC layers
    Rohmfeld, S
    Hundhausen, M
    Ley, L
    SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 : 657 - 660