High-density IC/LSI package for communication electronics

被引：0
|
作者：
Suzuki, Hiromichi [1 ]
Endo, Tsuneo [1 ]
机构：
[1] Semiconductor & Integrated, Circuits Div, Hitachi, Ltd, Japan
来源：
Hitachi Review | 1993年 / 42卷 / 03期
关键词：
4;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：141 / 144
相关论文
共 50 条
  • [41] The control of the high-density microwave plasma for large-area electronics
    Shirai, H
    Sakuma, Y
    Ueyama, H
    THIN SOLID FILMS, 1999, 337 (1-2) : 12 - 17
  • [42] Development of Au reflection film with high adhesion for high-density optical interconnection between LSI chips
    Yokota, K
    Satoh, R
    Iwata, Y
    Fujimoto, K
    Ura, S
    Kintaka, K
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (01): : 54 - 59
  • [43] Via-on-chip package aims at high-rel, high-density ICs
    Chin, S
    ELECTRONIC PRODUCTS MAGAZINE, 1998, 41 (05): : 26 - 26
  • [44] Aligned, high-density semiconducting carbon nanotube arrays for high-performance electronics
    Liu, Lijun
    Han, Jie
    Xu, Lin
    Zhou, Jianshuo
    Zhao, Chenyi
    Ding, Sujuan
    Shi, Huiwen
    Xiao, Mengmeng
    Ding, Li
    Ma, Ze
    Jin, Chuanhong
    Zhang, Zhiyong
    Peng, Lian-Mao
    SCIENCE, 2020, 368 (6493) : 850 - +
  • [45] Pre-fabricated High-density TSV Interposer for Programmable IC Applications
    Ouyang, T. Y.
    Hung, Y. T.
    Lee, O. H.
    Li, S. Y.
    Chiu, W. L.
    Hung, T. Y.
    Wu, S. H.
    Chang, H. H.
    2022 17TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2022,
  • [46] Study of low temperature cofired AIN/glass composite for high-density package
    Liao, Miao
    Li, Yuesheng
    Wang, Rongchang
    Rong, Ruifen
    Gu, Zhiguang
    Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics, 2003, 23 (04): : 520 - 525
  • [47] Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections
    Bansal, S
    Saxena, A
    Tummala, RR
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1647 - 1651
  • [48] CALCULATION OF CAPACITANCES OF CHIP-TO-CHIP INTERCONNECTIONS ON A HIGH-DENSITY MULTICHIP PACKAGE
    NAYAK, D
    HWANG, LT
    TURLIK, I
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 202 - 212
  • [49] The insulating materials for high density wiring formation on next generation's IC package
    Mago G.
    Mago, Genjin, 2018, Japan Institute of Electronics Packaging (21) : 198 - 201
  • [50] Overlapping Impacts and Resource Coordination for High-density Wireless Communication
    Zheng, Li
    Hoang, Doan B.
    2009 IEEE-RIVF INTERNATIONAL CONFERENCE ON COMPUTING AND COMMUNICATION TECHNOLOGIES: RESEARCH, INNOVATION AND VISION FOR THE FUTURE, 2009, : 180 - 186
12345