High-density IC/LSI package for communication electronics

被引:0
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作者
Suzuki, Hiromichi [1 ]
Endo, Tsuneo [1 ]
机构
[1] Semiconductor & Integrated, Circuits Div, Hitachi, Ltd, Japan
来源
Hitachi Review | 1993年 / 42卷 / 03期
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页码:141 / 144
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