Behavior of Copper Anodes in Electroplating Baths.

被引：0
|
作者：
Pfeifer, H.
von Krusenstjern, A.
机构：
来源：
Galvanotechnik | 1976年 / 67卷 / 10期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The sulfuric acid copper electrolyte with additives was found to possess a high limiting diffusion current density for all copper specimens used as anodes. The additive-containing cyanide electrolyte is characterized for all copper anodes investigated by medium limiting diffusion, current density, and a medium exchange current density which means that the latter electrolyte operates closer to the optimum.
引用
收藏
页码：808 / 817
相关论文
共 50 条
  • [31] DISSOLUTION OF COPPER ANODES IN SULFURIC-ACID BATHS
    WALLBAUM, HJ
    STEINKAMP, W
    LUETIC, R
    METALL, 1978, 32 (11): : 1135 - 1138
  • [32] New metrology system of organic additives in copper electroplating baths
    Hong, KM
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2003, 43 (02) : 286 - 289
  • [33] CHROMATOGRAPHIC DETERMINATION OF TOTAL CARBON IN NICKEL AND COPPER ELECTROPLATING BATHS
    REZCHIKOV, VG
    KUZNETSOVA, TS
    LOBYNTSEVA, EY
    INDUSTRIAL LABORATORY, 1990, 56 (06): : 648 - 650
  • [34] Process Control for Chemical Nickel Baths.
    Grossmann, H.
    Galvanotechnik, 1986, 77 (03): : 582 - 584
  • [35] ELECTROLYTIC BORIDING IN INDUCTION SALT BATHS.
    Simonenko, A.N.
    Shestakov, V.A.
    Garbi, G.G.
    Poboinya, V.N.
    Metal Science and Heat Treatment (English Translation of Metallovedenie i Termicheskaya Obrabotka Metallov), 1981, 23 (7-8): : 538 - 540
  • [36] Glass tile inspirations for kitchens & baths.
    Williamson, Gayle A.
    LIBRARY JOURNAL, 2007, 132 (01) : 104 - 104
  • [37] A thermoscope for liquid-air baths.
    Karrer, E
    JOURNAL OF THE FRANKLIN INSTITUTE, 1926, 202 : 809 - 810
  • [38] FILMING BEHAVIOR OF LEAD ANODES FOR CHROMIUM ELECTROPLATING
    MCBURNEY, MJP
    GABE, DR
    SURFACE TECHNOLOGY, 1979, 9 (04): : 253 - 266
  • [39] pH in alkaline cyanide plating baths.
    不详
    JOURNAL OF THE FRANKLIN INSTITUTE, 1940, 229 : 645 - 646
  • [40] Performance characteristics of different forms of anodes in copper electroplating
    Sriveeraraghavan, S
    Krishnan, RM
    Jayakrishnan, S
    Natarajan, SR
    Murugadoss, K
    Ramanan, CV
    BULLETIN OF ELECTROCHEMISTRY, 2001, 17 (03): : 137 - 140
12345