Behavior of Copper Anodes in Electroplating Baths.

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作者
Pfeifer, H.
von Krusenstjern, A.
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Galvanotechnik | 1976年 / 67卷 / 10期
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摘要
The sulfuric acid copper electrolyte with additives was found to possess a high limiting diffusion current density for all copper specimens used as anodes. The additive-containing cyanide electrolyte is characterized for all copper anodes investigated by medium limiting diffusion, current density, and a medium exchange current density which means that the latter electrolyte operates closer to the optimum.
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页码:808 / 817
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