共 50 条
- [42] Mechanical Reliability - Some Models for Lifelength Prediction. Sveriges Mekanforbund, Mekanresultat, 1985,
- [43] TEMPERATURE EVALUATION IN MICRO-ELECTRONIC STRUCTURES USING ANALOG NETWORKS IEEE TRANSACTIONS ON PRODUCT ENGINEERING AND PRODUCTION, 1965, PEP9 (01): : 13 - &
- [44] Comparison of micro-electronic test structures for noise measurement verification ICMTS 1999: PROCEEDINGS OF THE 1999 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, 1999, : 40 - 44
- [45] Shape optimization of micro-channel heat sink for micro-electronic cooling IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02): : 322 - 330
- [47] Sources of creep data scattering of solders in micro-electronic packaging 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1796 - +
- [48] Reliability prediction and assessment of electronic systems and equipment IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (01): : 127 - 128
- [49] UNCERTAINTIES IN COST ESTIMATING AS APPLIED TO MICRO-ELECTRONIC COMPONENT MANUFACTURING AACE BULLETIN, 1969, 11 (01): : 14 - &
- [50] Optimization study of stacked micro-channel heat sinks for micro-electronic cooling IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (01): : 55 - 61