SURVEY OF RADIATION HARDENED MICRO-ELECTRONIC MEMORY TECHNOLOGY

被引:2
|
作者
VAIL, PJ
机构
关键词
D O I
10.1109/TNS.1978.4329513
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1196 / 1204
页数:9
相关论文
共 50 条
  • [1] APPRAISAL OF MICRO-ELECTRONIC TECHNOLOGY
    HASLAM, J
    NATIONAL WESTMINSTER BANK QUARTERLY REVIEW, 1979, (MAY): : 55 - 64
  • [2] MICRO-ELECTRONIC REVOLUTION
    ROLAND, J
    FUTURIST, 1979, 13 (02) : 81 - 90
  • [3] MICRO-ELECTRONIC MAGNETIC TRANSDUCERS
    HOLLIS, JEL
    MEASUREMENT AND CONTROL, 1973, 6 (01): : 38 - 40
  • [4] GLASS APPLICATIONS IN ELECTRONIC AND MICRO-ELECTRONIC DEVICES
    BUCHANAN, RC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C336 - C336
  • [5] MICRO-ELECTRONIC CIRCUIT ELEMENTS
    MEINDL, JD
    USPEKHI FIZICHESKIKH NAUK, 1979, 127 (02): : 297 - 317
  • [6] VARIABLE MICRO-ELECTRONIC INDUCTORS
    SALEH, N
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (01): : 118 - 124
  • [8] MICRO-ELECTRONIC REVOLUTION .1.
    FORESTER, T
    NEW SOCIETY, 1978, 46 (840): : 330 - 332
  • [9] On wire failures in micro-electronic packages
    van Driel, WD
    Janssen, JHJ
    van Silfhout, RBR
    van Gils, MAJ
    Zhang, GQ
    Ernst, LJ
    THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 53 - 57
  • [10] Reliability problems of micro-electronic encapsulations
    Băjenescu T.-M.I.
    EEA - Electrotehnica, Electronica, Automatica, 2021, 69 (01): : 74 - 80