Cleavable epoxy for reworkable encapsulation

被引：0
|
作者：
Buchwalter, S.L.
Kosbar, L.L.
Gelorme, J.D.
机构：
来源：
Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering | 1995年 / 72卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] EPOXY ENCAPSULATION ON CERAMIC QUAD FLAT PACKS (CQFPS)
    CLEMENTI, J
    CARDEN, T
    ENGLE, S
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (04): : 559 - 563
  • [32] ZrO2/epoxy nanocomposite for LED encapsulation
    Chung, Pao Tang
    Yang, Chun Ting
    Wang, Sho Hsun
    Chen, Chien Wei
    Chiang, Anthony S. T.
    Liu, Cheng-Yi
    MATERIALS CHEMISTRY AND PHYSICS, 2012, 136 (2-3) : 868 - 876
  • [33] EPOXY MOLDING COMPOUNDS AS ENCAPSULATION MATERIALS FOR MICROELECTRONIC DEVICES
    KINJO, N
    OGATA, M
    NISHI, K
    KANEDA, A
    ADVANCES IN POLYMER SCIENCE, 1989, 88 : 1 - 48
  • [34] Controlled degradation of epoxy networks: analysis of crosslink density and glass transition temperature changes in thermally reworkable thermosets
    Chen, JS
    Ober, CK
    Poliks, MD
    Zhang, YM
    Wiesner, U
    Cohen, C
    POLYMER, 2004, 45 (06) : 1939 - 1950
  • [35] New chemically reworkable epoxy coatings obtained by the addition of polyesters with star topologies to diglycidyl ether of bisphenol A resins
    Tomuta, Adrian M.
    Ramis, Xavier
    Fernandez-Francos, Xavier
    Ferrando, Francesc
    Serra, Angels
    PROGRESS IN ORGANIC COATINGS, 2013, 76 (11) : 1616 - 1624
  • [36] Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria
    Teng, Lip Saw
    Devarajan, Mutharasu
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1750 - 1753
  • [37] Phosphorus-containing liquid cycloaliphatic epoxy resins for reworkable environment-friendly electronic packaging materials
    Liu, Wanshuang
    Wang, Zhonggang
    Xiong, Li
    Zhao, Linni
    POLYMER, 2010, 51 (21) : 4776 - 4783
  • [38] Modification of epoxy resin with siloxane containing phenol aralkyl epoxy resin for electronic encapsulation application
    Ho, TH
    Wang, CS
    EUROPEAN POLYMER JOURNAL, 2001, 37 (02) : 267 - 274
  • [39] Dispositioning defective but reworkable product
    Lagacy, L
    Gaboriault, M
    1996 ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - ASMC 96 PROCEEDINGS: THEME - INNOVATIVE APPROACHES TO GROWTH IN THE SEMICONDUCTOR INDUSTRY, 1996, : 236 - 240
  • [40] Reworkable UV curing materials
    Shirai, Masamitsu
    PROGRESS IN ORGANIC COATINGS, 2007, 58 (2-3) : 158 - 165
12345