Cleavable epoxy for reworkable encapsulation

被引:0
|
作者
Buchwalter, S.L.
Kosbar, L.L.
Gelorme, J.D.
机构
来源
Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering | 1995年 / 72卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin
    Fan, LH
    Wong, CP
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 148 - 155
  • [22] Design and characterization of a new reworkable epoxy using solvent free, thermally induced network breakdown
    Yang, S
    Chen, J
    Korner, H
    Breiner, T
    Ober, C
    Poliks, MD
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 214 : 270 - POLY
  • [23] Cleavable epoxy networks using azomethine-bearing amine hardeners
    Chanteli, Angeliki
    Conaire, Marcus O.
    Brannigan, Ruairi
    Heise, Andreas
    Weaver, Paul M.
    Manolakis, Ioannis
    REACTIVE & FUNCTIONAL POLYMERS, 2022, 178
  • [24] ON THE SIMULATION OF MICROELECTRONIC ENCAPSULATION WITH EPOXY MOLDING COMPOUND
    TURNG, LS
    WANG, VW
    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, 1993, 12 (05) : 506 - 519
  • [25] Epoxy molding compounds for the encapsulation of electronic components
    Garrett, DW
    BROADER MEANING TO THERMOSETS, 1998, : 63 - 67
  • [26] GLASS BUBBLES LIGHTEN EPOXY ENCAPSULATION MATERIAL
    SODERHOL.LG
    DESIGN NEWS, 1970, 25 (01) : 46 - +
  • [27] CATALYSTS FOR EPOXY MOLDING COMPOUNDS IN MICROELECTRONIC ENCAPSULATION
    MIH, WC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1983, 185 (MAR): : 62 - ORPL
  • [28] RELIABILITY OF EPOXY MOLDING COMPOUND FOR ENCAPSULATION OF SEMICONDUCTOR
    KAKEI, M
    IKEDA, Y
    TANIMOTO, S
    TANAKA, K
    KOSHIBE, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (08) : C318 - C318
  • [29] EPOXY ENCAPSULATION OF THIN-FILM RESISTORS
    DUBEY, GC
    INDIAN JOURNAL OF TECHNOLOGY, 1980, 18 (12): : 517 - 518
  • [30] Liquid epoxy resins for encapsulation of integrated circuits elements
    Halasa, E
    POLIMERY, 2004, 49 (09) : 595 - 601