共 50 条
- [21] Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 148 - 155
- [22] Design and characterization of a new reworkable epoxy using solvent free, thermally induced network breakdown ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 214 : 270 - POLY
- [23] Cleavable epoxy networks using azomethine-bearing amine hardeners REACTIVE & FUNCTIONAL POLYMERS, 2022, 178
- [25] Epoxy molding compounds for the encapsulation of electronic components BROADER MEANING TO THERMOSETS, 1998, : 63 - 67
- [27] CATALYSTS FOR EPOXY MOLDING COMPOUNDS IN MICROELECTRONIC ENCAPSULATION ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1983, 185 (MAR): : 62 - ORPL
- [29] EPOXY ENCAPSULATION OF THIN-FILM RESISTORS INDIAN JOURNAL OF TECHNOLOGY, 1980, 18 (12): : 517 - 518