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- [1] CLEAVABLE EPOXY FOR REWORKABLE ENCAPSULATION ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1995, 209 : 253 - PMSE
- [3] A reworkable epoxy resin for isotropically conductive adhesive 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1391 - 1397
- [4] Evaluation of reworkable underfills for area array packaging encapsulation INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 29 - 36
- [5] A reworkable epoxy resin for isotropically conductive adhesive IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01): : 165 - 172
- [8] Synthesis of tertiary ester epoxy resin and application in reworkable underfill 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 196 - 199
- [9] Development of new reworkable epoxy resins for flip chip underfill applications INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 289 - 294