Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating

被引：0
|
作者：
机构：
[1] Chang, Tao-Chih
[2] Hsu, Ying-Tun
[3] Hon, Min-Hsiung
[4] Wang, Moo-Chin
来源：
Chang, T.-C. (n5889114@sparc1.cc.ncku.edu.tw) | 1600年 / Elsevier BV卷 / 360期
关键词：
Number:; NSC89-2216-E-151-011; Acronym:; NSC; Sponsor: National Science Council;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 2
相关论文
共 50 条
  • [41] Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys
    Dheeraj Varanasi
    Manoj Kumar Pal
    Powder Metallurgy and Metal Ceramics, 2021, 60 : 504 - 512
  • [42] Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy
    Gao, Feng
    Cheng, Fangjie
    Nishikawa, Hiroshi
    Takemoto, Tadashi
    MATERIALS LETTERS, 2008, 62 (16) : 2257 - 2259
  • [43] Influence of Nano-TiO2 Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5Ag0.5Zn Composite Solder/Cu Solder Joints
    Feng, L. P.
    Chang, S. Y.
    Tsao, L. C.
    Wang, F. S.
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 260 - 263
  • [44] Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition
    Che, F. X.
    Zhu, W. H.
    Poh, Edith S. W.
    Zhang, X. R.
    Zhang, Xiaowu
    Chai, T. C.
    Gao, S.
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (03) : 344 - 354
  • [45] Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition
    F. X. Che
    W. H. Zhu
    Edith S. W. Poh
    X. R. Zhang
    Xiaowu Zhang
    T. C. Chai
    S. Gao
    Journal of Electronic Materials, 2011, 40 : 344 - 354
  • [46] Effect of P, Ag on the Oxidation-Resistance of Sn-0.5Cu Lead-Free Solder
    Liu, Si-dong
    Xue, Feng
    Zhou, Jian
    PROCEEDINGS OF THE 7TH NATIONAL CONFERENCE ON CHINESE FUNCTIONAL MATERIALS AND APPLICATIONS (2010), VOLS 1-3, 2010, : 609 - 613
  • [47] Creep behavior of eutectic Sn-Ag lead-free solder alloy
    Huang, ML
    Wang, L
    Wu, CML
    JOURNAL OF MATERIALS RESEARCH, 2002, 17 (11) : 2897 - 2903
  • [48] Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes
    Takahashi, J
    Nakahara, S
    Hisada, S
    Fujita, T
    FIFTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, 2004, 5662 : 355 - 360
  • [49] An assessment of lead free solder (Sn3.7Ag0.8Cu) wettability
    Chung, CK
    Mustapha, F
    Hua, F
    Aspandiar, R
    PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 1 - 5
  • [50] Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application
    Jamadon, Nashrah Hani
    Yusof, Farazila
    Abd Shukor, Mohd Hamdi
    Ariga, Tadashi
    Miyashita, Yukio
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
12345