Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating

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[1] Chang, Tao-Chih
[2] Hsu, Ying-Tun
[3] Hon, Min-Hsiung
[4] Wang, Moo-Chin
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Chang, T.-C. (n5889114@sparc1.cc.ncku.edu.tw) | 1600年 / Elsevier BV卷 / 360期
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Number:; NSC89-2216-E-151-011; Acronym:; NSC; Sponsor: National Science Council;
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