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- [42] Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1531 - 1535
- [44] Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (12): : 2040 - 2045
- [45] GaN Based Active Matrix Light Emitting Diode Array by Flip-Chip Technology AOE 2008: ASIA OPTICAL FIBER COMMUNICATION AND OPTOELECTRONIC EXPOSITION AND CONFERENCE, 2009,
- [46] Packaging of laser array modules in flip-chip bonding LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 673 - 674
- [47] Thermal fatigue analysis of the Flip-Chip assembly on the Polymer Stud Grid Array (PSGA™) package 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 823 - 829