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- [21] Improving the component level reliability of a flip-chip Ball-Grid-Array (FCBGA) package using numerical modeling method ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 586 - 590
- [22] A study in establishing flip-chip ball grid array (FCBGA) second level interconnect (SLI) reliability requirement by CFD simulation EMAP 2005: INTERNATIONAL SYMPOSIUM ON ELECTRONICS MATERIALS AND PACKAGING, 2005, : 292 - 295
- [23] Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 1040 - +
- [24] A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (12): : 1784 - 1792
- [26] Flip chip ball grid array component testing under board flexure 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 937 - 944
- [27] Characterization of molded underfill material for flip chip ball grid array packages 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 288 - 292
- [29] LC-based WiFi and WiMAX baluns embedded in a multilayer organic flip-chip ball grid array (FCBGA) package substrate 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 169 - +
- [30] Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies Journal of Electronic Materials, 2014, 43 : 671 - 684