Flip chip on PCBs with anisotropic conductive film

被引:0
|
作者
机构
来源
Adv Packag | / 6卷 / 44期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Experimental and Modeling analysis on moisture induced failures in flip chip on flex interconnections with anisotropic conductive film
    Yin, CY
    Lu, H
    Bailey, C
    Chan, YC
    2005 INTERNATIONAL CONFERENCE ON ASIAN GREEN ELECTRONICS: DESIGN FOR MANUFACTURABILITY AND RELIABILITY, PROCEEDINGS, 2004, : 172 - 177
  • [42] Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications
    S. H. Fan
    Y. C. Chan
    Journal of Electronic Materials, 2003, 32 : 101 - 108
  • [43] Fine pitch compliant bump interconnection for flip chip on flexible display packaging by anisotropic conductive film
    Lin, Yao-Sheng
    Yang, Tsung-Fu
    Chen, Wen-Chi
    Chen, Tai-Hung
    Cheng, Chun-Cheng
    Yeh, Yung-Hui
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 501 - +
  • [44] Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
    Kim, Jong-Woong
    Jung, Seung-Boo
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 452 : 267 - 272
  • [45] Development of solder replacement flip chip using anisotropic conductive adhesives
    Min, TA
    Lim, SPS
    Lee, C
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 390 - 396
  • [46] Flip chip assembly utilizing anisotropic conductive films: A feasibility study
    Delaney, D
    White, J
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 641 - 645
  • [47] RF characterization of flip-chip Anisotropic Conductive Adhesives joints
    Wang, Xu
    Cheng, Zhaonian
    Liu, Johan
    2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 123 - +
  • [48] Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
    Yim, MJ
    Kim, HJ
    Paik, KW
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (08) : 1165 - 1171
  • [49] Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
    M. J. Yim
    H -J. Kim
    K. -W. Paik
    Journal of Electronic Materials, 2005, 34 : 1165 - 1171
  • [50] Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
    Yim, MJ
    Hwang, JS
    Kim, JG
    Kim, HJ
    Kwon, W
    Jang, KW
    Paik, KW
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 159 - 164