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- [47] RF characterization of flip-chip Anisotropic Conductive Adhesives joints 2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 123 - +
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- [50] Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 159 - 164