Flip chip on PCBs with anisotropic conductive film

被引：0
|
作者：
机构：
来源：
Adv Packag | / 6卷 / 44期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Influence of the Bonding Force, Anisotropic conductive film (ACF) and Reflow Process on the Flip Chip Assembly
    Madalossi, N. V.
    Otta, M.
    Mazon, T.
    MICROELECTRONICS TECHNOLOGY AND DEVICES - SBMICRO 2010, 2010, 31 (01): : 189 - 196
  • [32] Flip chip on paper assembly utilizing anisotropic conductive adhesive
    Rasul, J
    Olson, W
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 90 - 94
  • [33] Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
    J. W. Hwang
    M. J. Yim
    K. W. Paik
    Journal of Electronic Materials, 2006, 35 : 189 - 189
  • [34] Anisotropic conductive adhesive films for flip chip on flex packages
    Li, L
    Fang, TL
    4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 129 - 135
  • [35] Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
    Hwang, JW
    Yim, MJ
    Paik, KW
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (11) : 1455 - 1461
  • [36] ANISOTROPIC CONDUCTIVE ADHESIVES FOR CHIP ON GLASS AND OTHER FLIP-CHIP APPLICATIONS
    VANNOORT, HM
    KLOOS, MJH
    SCHAFER, HEA
    JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (01): : 27 - 31
  • [37] Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
    J. W. Hwang
    M. J. Yim
    K. W. Paik
    Journal of Electronic Materials, 2005, 34 : 1455 - 1461
  • [38] Deterioration mechanism of flip chip attachment using an anisotropic conductive film and design technology for high reliability
    Fujiwara, S
    Harada, M
    Fujita, Y
    Hachiya, T
    Muramatsu, M
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1124 - 1129
  • [39] Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications
    Fan, SH
    Chan, YC
    JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (02) : 101 - 108
  • [40] Process development of a flip chip in package with anisotropic conductive film (ACF) for lead-free soldering
    Siang, SLP
    Min, TA
    Lee, C
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 450 - 454
12345