Effects of grain size and abrasive size of polycrystalline nano-particle ceria slurry on shallow trench isolation chemical mechanical polishing

被引：0
|
作者：
Kang, Hyun-Goo [1 ,2 ]
Katoh, Takeo [1 ]
Kim, Sung-Jun [1 ]
Paik, Ungyu [2 ]
Park, Hyung-Soon [3 ]
Park, Jea-Gun [1 ]
机构：
[1] Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea, Republic of
[2] Department of Ceramic Engineering, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea, Republic of
[3] Hynix Semiconductor Inc., San 136-1, Ami-ri, Bubal-eub, Icheon, Kyungki-do 467-701, Korea, Republic of
来源：
Japanese Journal of Applied Physics, Part 2: Letters | 2004年 / 43卷 / 3 A期
关键词：
Ceria - CMP - Nanotopography - Oxide films - Secondary particle size - Shallow trench isolation;
D O I：
10.1143/jjap.43.l365
中图分类号：
学科分类号：
摘要：
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