Ceramic packaging by localized induction heating

被引:0
|
作者
Liu, Wen-Ming [1 ,2 ]
Chen, Ming-Xiang [1 ,2 ]
Liu, Sheng [1 ,2 ]
机构
[1] Wuhan National Laboratory for Optoelectronics, Huazhong Univ. of Sci. and Technol., Wuhan 430074, China
[2] Institute for Microsystems, Huazhong Univ. of Sci. and Technol., Wuhan 430074, China
关键词
8;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:365 / 369
相关论文
共 50 条
  • [21] Bonding of carbon nanotubes onto microelectrodes by localized induction heating
    Chen, Mingxiang
    Song, Xiaohui
    Lv, Qiang
    Gan, Zhiyin
    Liu, Sheng
    SENSORS AND ACTUATORS A-PHYSICAL, 2011, 170 (1-2) : 202 - 206
  • [22] Flow control using localized induction heating in a VARTM process
    Johnson, R. J.
    Pitchumani, R.
    COMPOSITES SCIENCE AND TECHNOLOGY, 2007, 67 (3-4) : 669 - 684
  • [23] Solder bonding with a buffer layer for MOEMS packaging using induction heating
    Hu, Chao-Chang
    Wen, Shih-Yi
    Hsu, Chen-Peng
    Chang, Chun-Wei
    Shig, Chih-Tsung
    Lee, Hsiao-Wen
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2006, 12 (10-11): : 1011 - 1014
  • [24] Solder bonding with a buffer layer for MOEMS packaging using induction heating
    Chao-Chang Hu
    Shih-Yi Wen
    Chen-Peng Hsu
    Chun-Wei Chang
    Chih-Tsung Shih
    Hsiao-Wen Lee
    Microsystem Technologies, 2006, 12 : 1011 - 1014
  • [25] Thermo-Mechanical Analysis of a Wafer Level Packaging by Induction Heating
    Liu, Wenming
    Chen, Mingxiang
    Xi, Yanyan
    Lin, Changyong
    Liu, Sheng
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 152 - 156
  • [26] Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems
    Knauf, Benedikt J.
    Webb, D. Patrick
    Liu, Changqing
    Conway, Paul P.
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 172 - +
  • [27] Localized induction heating of metallic spacers for energy -efficient membrane distillation
    Tan, Yong Zen
    Chandrakant, Sairaj Patil
    Ang, Joan Shu Ting
    Wang, Hou
    Chew, Jia Wei
    JOURNAL OF MEMBRANE SCIENCE, 2020, 606
  • [28] VITRIFICATION OF SIMULATED HLLW BY DIRECT INDUCTION-HEATING IN THE CERAMIC MELTER
    OKA, KO
    OGUINO, N
    MATSUMOTO, TE
    AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (08): : 865 - 866
  • [29] Selective induction heating of metallic microstructures for wafer-level MEMS packaging
    Froehlich, Alexander
    Hofmann, Christian
    Rochala, Patrick
    Kimme, Jonas
    Kroll, Martin
    Kraeusel, Verena
    INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS, 2020, 63 : S13 - S20
  • [30] Research on a New Localized Induction Heating Process for Hot Stamping Steel Blanks
    Bao, Li
    Chen, Jingqi
    Li, Qi
    Gu, Yu
    Wu, Jian
    Liu, Weijie
    MATERIALS, 2019, 12 (07):