Advanced packaging technologies for super computer and mobile terminal

被引:0
|
作者
机构
来源
| 1600年 / Japan Institute of Electronics Packaging, 4F Toranomon Sangyo Bldg. 2-29, Toranomon 1-chome, Minato-ku, Tokyo, 105-0001, Japan卷 / 16期
关键词
D O I
10.5104/jiep.16.35
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Applied advanced computer technologies in dermatology
    Dugonik, B
    Dugonik, A
    Brezocnik, Z
    MEDICON 2001: PROCEEDINGS OF THE INTERNATIONAL FEDERATION FOR MEDICAL & BIOLOGICAL ENGINEERING, PTS 1 AND 2, 2001, : 123 - 126
  • [22] Die singulation technologies for advanced packaging: A critical review
    Lei, Wei-Sheng
    Kumar, Ajay
    Yalamanchili, Rao
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2012, 30 (04):
  • [23] Advanced Packaging Technologies for Co-packaged Optics
    Lu, Mei-Ju
    Mu, Sin-Yuan
    Cheng, Chia-Sheng
    Chen, Jihan
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 38 - 42
  • [24] Development of Packaging Technologies for Advanced SiC Power Modules
    Liang, Zhenxian
    Wang, Fred
    Tolbert, Leon
    2014 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2014, : 41 - 46
  • [25] Advanced Packaging Technologies supporting new semiconductor application
    Ooida, Mitsuru
    Taniguchi, Fumihiko
    Iwasaki, Toshihiro
    Ono, Akinori
    Asano, Yuichi
    Hiruta, Yoichi
    2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 125 - 128
  • [26] A Characterized Redistribution Layer Architecture for Advanced Packaging Technologies
    Kudo, Hiroshi
    Takano, Takamasa
    Tanaka, Masaya
    Kasai, Ryohhei
    Suyama, Jyunichi
    Akazawa, Miyuki
    Takeda, Mitsuhiro
    Mawatari, Hiroshi
    Sasao, Toshio
    Okazaki, Yumi
    Oota, Naoki
    Tashiro, Susumu
    Iida, Haruo
    Sakamoto, Kouji
    Sato, Hiroyuki
    Kitayama, Daisuke
    Yamada, Shouhei
    Kuramochi, Satoru
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2063 - 2067
  • [27] ADVANCED MANUFACTURING AND PACKAGING TECHNOLOGIES FOR MILITARY AND COMMERCIAL MARKETS
    NAGY, C
    SHUMWAY, L
    GOMESCASSERES, M
    MICROWAVE JOURNAL, 1995, 38 (08) : 22 - &
  • [28] Interconnect Technologies and Advanced Packaging for High Performance Computing
    Shi, Jing
    Sze, Theresa
    Song, Deqiang
    Huang, Dawei
    Cunningham, John E.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 819 - 824
  • [29] Use of Computer and Mobile Technologies in the Treatment of Depression
    Callan, Judith A.
    Wright, Jesse
    Siegle, Greg J.
    Howland, Robert H.
    Kepler, Britney B.
    ARCHIVES OF PSYCHIATRIC NURSING, 2017, 31 (03) : 311 - 318
  • [30] Advanced Mobile Terminal for Heterogeneous Wireless Networks
    Shuminoski, Tomislav
    Janevski, Toni
    INTERNATIONAL JOURNAL OF GRID AND DISTRIBUTED COMPUTING, 2014, 7 (06): : 111 - 128