Advanced Packaging Technologies supporting new semiconductor application

被引：0
|
作者：
Ooida, Mitsuru [1 ]
Taniguchi, Fumihiko [1 ]
Iwasaki, Toshihiro [1 ]
Ono, Akinori [1 ]
Asano, Yuichi [1 ]
Hiruta, Yoichi [1 ]
机构：
[1] J DEVICES Corp, Packaging Res & Dev Ctr, Yokohama, Kanagawa, Japan
来源：
2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2016年
关键词：
wire bonding; flip-chip; RDL; Interconenction;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Packaging interconnect technologies which connect between semiconductor and interposer have been developed by changing with wire bonding, flip-chip and re-distribution layer (RDL). The latest interconnect technologies are introduced.
引用
收藏
页码：125 / 128
页数：4
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