Anisotropic etching in inductive plasma source with no rf biasing

被引:0
|
作者
Park, Wontaek [1 ]
机构
[1] Guan Plasma Acceleration Laboratory, 524-2, Sang-Dong, Wonmi-Ku, Bucheon City, Kyongki-Do 420-030, Korea, Republic of
来源
Journal of Applied Physics | 2008年 / 104卷 / 06期
关键词
6;
D O I
暂无
中图分类号
学科分类号
摘要
Journal article (JA)
引用
收藏
相关论文
共 50 条
  • [41] Defining conditions for the etching of silicon in an inductive coupled plasma reactor
    Ashraf, H
    Bhardwaj, JK
    Guibarra, E
    Hall, S
    Hopkins, J
    Hynes, AM
    Johnston, I
    Lea, L
    McAuley, S
    Nicholls, G
    O'Brien, P
    MATERIALS SCIENCE OF MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES II, 2000, 605 : 299 - 304
  • [42] ANISOTROPIC FILMS DEPOSITED BY THE RF PLASMA TECHNIQUE
    SPROKEL, GJ
    JOURNAL OF ELECTRONIC MATERIALS, 1979, 8 (05) : 708 - 708
  • [43] Resonant planar antenna as an inductive plasma source
    Guittienne, Ph.
    Lecoultre, S.
    Fayet, P.
    Larrieu, J.
    Howling, A. A.
    Hollenstein, Ch.
    JOURNAL OF APPLIED PHYSICS, 2012, 111 (08)
  • [44] CMOS RF design for reliability using adaptive gate-source biasing
    Yuan, J. S.
    Tang, H.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (09) : 2348 - 2353
  • [45] Characteristics of etching residues on the upper sidewall after anisotropic plasma etching of silicon
    Lee, Jaemin
    Lee, Hyun Woo
    Kwon, Kwang-Ho
    APPLIED SURFACE SCIENCE, 2020, 517 (517)
  • [46] RF plasma selective etching of boron nitride films
    Werbowy, A
    Szmidt, J
    Sokolowska, A
    Mitura, S
    DIAMOND AND RELATED MATERIALS, 2000, 9 (3-6) : 609 - 613
  • [47] Temperature and RF Current Sensor Wafers for Plasma Etching
    Milenin, A. P.
    Demand, M.
    Boullart, W.
    Arleo, P.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 159 (01) : H5 - H10
  • [48] Plasma parameters investigation of the RF inductive plasma source with diameter 46 cm. Part III. Power absorption efficiency
    Aleksandrov, A.F.
    Vavilin, K.V.
    Kralkina, E.A.
    Neklyudovav, P.A.
    Pavlov, V.B.
    Applied Physics, 2014, (02): : 17 - 20
  • [49] CHOICE OF BIASING FUNCTION FOR SOURCE BIASING
    GELBARD, EM
    NUCLEAR SCIENCE AND ENGINEERING, 1986, 94 (03) : 274 - 276
  • [50] Anisotropic Si reactive ion etching in fluorinated plasma
    Malinin, A
    Majamaa, T
    Hovinen, A
    MICROELECTRONIC ENGINEERING, 1998, 43-4 : 641 - 645