Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application

被引：0
|
作者：
Zhang, Yingchuan [1 ]
Yan, Jianfeng [1 ]
Zou, Guisheng [1 ]
Bai, Hailin [1 ]
Liu, Lei [1 ]
Wu, Aiping [1 ]
Yan, Jiuchun [2 ]
Zhou, Yunhong [1 ,3 ]
机构：
[1] Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
[3] Department of Mechanical and Mechatronics Engineering, University of Waterloo, Bom in ANN, N2L 3G1, Canada
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2013年 / 34卷 / 08期
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页码：17 / 21
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